標(biāo)準(zhǔn)去膠規(guī)格
Ash Rate: ≥ 5.0μm/min
Non Unif Across Wafer: ≤5%
Based on 1.2 μm PR / 3mm from EBR
Non Unif Wafer to Wafer, Head-to-Head: ≤5%
Particles: ≤ 0.04 Particles/cm2 @ >0.2μm
生產(chǎn)效率規(guī)格
Productivity Specification
Uptime: > 95%
MTBF: > 400 hrs
MTTR: < 4 hrs
Throughput：130pcs/hr
Wafer Breakage: < 1 in 20Kwfrs
Average System Installation Time: < 2 weeks(from move-in time to process qualification)
特定
High strip rateμ(> 5μm/min)
Loadlocked design
Multiple process stations (4 max)